Photochemical surface modification of flexible plastic substrate for organic light-emitting diodes

Yadong Jiang; Hui Lin; Shuangling Lou; Junsheng Yu

doi:10.1117/12.831035

21 May 2009 Photochemical surface modification of flexible plastic substrate for organic light-emitting diodes

Yadong Jiang, Hui Lin, Shuangling Lou, Junsheng Yu

Proceedings Volume 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 72823E (2009) https://doi.org/10.1117/12.831035
Event: AOMATT 2008 - 4th International Symposium on Advanced Optical Manufacturing, 2008, Chengdu, Chengdu, China

Abstract

A method using UV-curable epoxy resin is described to modify organic polymer substrates without changing the bulk properties of substrate material. The reagents contain an acrylate or other photoactive group which, when exposed to light of appropriate wavelength, generates highly reactive intermediates that covalently bond with nearly any organic material. Applying epoxy resin onto the surfaces of such materials, the surface properties can be modified to achieve greatly increased bond strengths with conventional adhesives. Flexible organic light-emitting diode (FOLED) is fabricated on indium-tin oxide (ITO) plastic substrate by inserting a UV-curable epoxy resin as a buffer layer between plastic substrate and ITO film. A maximum luminance of FOLED of 4,860 cd/m² at 12 V is obtained.

Citation Download Citation

Yadong Jiang, Hui Lin, Shuangling Lou, and Junsheng Yu "Photochemical surface modification of flexible plastic substrate for organic light-emitting diodes", Proc. SPIE 7282, 4th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 72823E (21 May 2009); https://doi.org/10.1117/12.831035

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KEYWORDS

Positron emission tomography

Ultraviolet radiation

Organic light emitting diodes

Epoxies

Lithium

Ultrasonics

Adhesives

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