Material characterization and multi-scale modeling of light activated SMP

Richard V. Beblo; Lisa Mauck Weiland

doi:10.1117/12.815504

31 March 2009 Material characterization and multi-scale modeling of light activated SMP

Richard V. Beblo, Lisa Mauck Weiland

Proceedings Volume 7290, Industrial and Commercial Applications of Smart Structures Technologies 2009; 72900L (2009) https://doi.org/10.1117/12.815504
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2009, San Diego, California, United States

Abstract

Stiffness variation versus stimulation for a light activated shape memory polymer (LASMP) is predicted with a multiscale modeling approach. The multiscale model utilizes rotational isomeric state theory to build a polymer chain conformation, Johnson distributions to model the distances between crosslinks, junction constraints to model neighboring chain interactions, and Boltzmann statistical mechanics to relate the entropy of the chain to the macroscopic response. It is shown that a novel choice for the equation describing stress dependence on strain, capturing the polymer's departure from affine deformation, results in a stress strain curve with an expected shape. The fitting parameters characterizing the interaction with neighboring chains can also be phenomenologically fit to experimental data, yielding accurate modulus predictions. The result is a bottom up model accurately predicting the material response of the polymer with parameters that can be derived almost entirely from the molecular formula of the polymer, allowing sufficiently similar polymers to be modeled accurately, reducing the time, effort, and resources required in the development of new polymer systems.

Citation Download Citation

Richard V. Beblo and Lisa Mauck Weiland "Material characterization and multi-scale modeling of light activated SMP", Proc. SPIE 7290, Industrial and Commercial Applications of Smart Structures Technologies 2009, 72900L (31 March 2009); https://doi.org/10.1117/12.815504

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