A comparison of cure monitoring techniques

Liwei Wang; Venkata R. Machavaram; Ramani Mahendran; Dee Harris; Surya D. Pandita; Andrew Tomlin; Eleanor Redmore; Shoaib A. Malik; Gerard F. Fernando

doi:10.1117/12.817625

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1 April 2009 A comparison of cure monitoring techniques

Liwei Wang, Venkata R. Machavaram, Ramani Mahendran, Dee Harris, Surya D. Pandita, Andrew Tomlin, Eleanor Redmore, Shoaib A. Malik, Gerard F. Fernando

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Proceedings Volume 7292, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009; 729213 (2009) https://doi.org/10.1117/12.817625
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2009, San Diego, California, United States

Abstract

Significant progress has been made in recent years on the design and deployment of optical fibre-based sensors to monitor the cross-linking (cure) reactions in thermosetting resins. In the current study, the following sensor designs were used to study cross-linking reactions of an epoxy/amine resin system: (i) intensity-based Fresnel sensors, (ii) extrinsic fibre Fabry-Perot interferometic (EFPI) sensors, (iii) fibre Bragg grating (FBG) sensors and (iv) sensor designs to enable transmission, reflection and evanescent wave spectroscopy. This paper presents a detailed study on a comparison of the above-mentioned techniques for a commercially available epoxy/amine resin system. Conventional Fourier transform infrared spectroscopy was used as the reference method for obtaining quantitative data on the cross-linking kinetics. The shrinkage of the resin during cross-linking was monitored using EFPI and FBG sensors. This paper also discusses the cross-linking data obtained using optical fibre-based evanescent wave spectroscopy.

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Liwei Wang, Venkata R. Machavaram, Ramani Mahendran, Dee Harris, Surya D. Pandita, Andrew Tomlin, Eleanor Redmore, Shoaib A. Malik, and Gerard F. Fernando "A comparison of cure monitoring techniques", Proc. SPIE 7292, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2009, 729213 (1 April 2009); https://doi.org/10.1117/12.817625

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