Pin-in-paste DFM constraints in vapor phase soldering technology for optoelectronic components

I. Plotog; G. Varzaru; C. Turcu; T. C. Cucu; P. Svasta; A. Vasile

doi:10.1117/12.823629

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6 January 2009 Pin-in-paste DFM constraints in vapor phase soldering technology for optoelectronic components

I. Plotog, G. Varzaru, C. Turcu, T. C. Cucu, P. Svasta, A. Vasile

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Proceedings Volume 7297, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IV; 72970J (2009) https://doi.org/10.1117/12.823629
Event: Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IV, 2008, Constanta, Romania

Abstract

The topical trends in the field of electronic equipments developing are a large integration on pcb support for different types of components and devices, including optoelectronic type, from small to medium power, in condition of reducing physical dimensions, in order to create new electronic products in short time at lower manufacturing cost. The condition for economical success for a product is to assure the product, even from the conception stage, with a high level of quality by reducing the product cost; to conclude, designing according with production possibilities by using Design For Manufacturing (DFM) concept. This desideratum depends on the conception and design of the product. According to DFM concept, a successful project assures design requirements for the system and finally for printed circuit boards (PCB), accomplishes the assembling technology constraints defined by international standards in the field of electronic packaging, such as IPC or Restriction of Hazardous Substances Directive. Active from July 1, 2006, the RoHS Directive 2002/95/EC adopted in February 2003 by the European Union, and adopted in Romania by HG - 992/2005, completed by HG - 816/2006, call forth important consequences in assembling technologies. In order to minimize manufacturing cost, Pin-In-Paste offers solutions for complete assembling of high complexity PCBs in Vapor Phase Technology using only one reflow machine avoiding overheating of the assemblies relatively to infrared reflow oven. Starting from RoHS consequences analysis, especially thermal profile, the paper presents the applied research performed in the assembling lines on VPS machine in order to define the design requirements for Pin-In-Paste dedicated stencils and PCBs, experiments result and conclusions regarding DFM requirements for lead-free assembling technologies of optoelectronic components. Finally, scientific and practical conclusions shall be drawn to configure the optimum implementation way for Pin-In-Paste in Vapor Phase Technology. The authors emphasizes that Vapor Phase Technology has all the conditions to become the disruptive technology of the moment.

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I. Plotog, G. Varzaru, C. Turcu, T. C. Cucu, P. Svasta, and A. Vasile "Pin-in-paste DFM constraints in vapor phase soldering technology for optoelectronic components", Proc. SPIE 7297, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IV, 72970J (6 January 2009); https://doi.org/10.1117/12.823629

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