Signal conditioner for LVDT displacement sensors

Marian Blejan; Ioana Ilie; Mircea Comes; Bogdan Lupu

doi:10.1117/12.823698

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7 January 2009 Signal conditioner for LVDT displacement sensors

Marian Blejan, Ioana Ilie, Mircea Comes, Bogdan Lupu

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Proceedings Volume 7297, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IV; 72972E (2009) https://doi.org/10.1117/12.823698
Event: Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IV, 2008, Constanta, Romania

Abstract

The paper describes a systematic approach regarding the development of a linear position and speed transducer used in hydraulic applications. The electronic module of the transducer is integrated into the LVDT sensor body, to obtain an assembly capable to operate into hydraulic specific environment conditions: vibrations, wide range of operating temperature and high humidity with condensation, significant mechanic and hydraulic shocks, important electromagnetic interference with the intense electric current circuits specific for hydraulic equipment a.o. To obtain the functioning and precision performances needed, it was assessed the use of a reduced number of small size electronic components. It was chosen an original solution for excitation and processing of the signal from the sensor that allows the direct connection of the sensor with the microcontroller used into the electronic module of the transducer. The power supply of the transducer was implemented throughout commutation (buck-converter) providing a superior efficiency and reducing the risk of overheating the electronic module by Joule effect. The performances determined by experiment confirms the designing data by meaning to obtain the position indication of 10000 of stabile divisions and the speed indication of 1000 stabile divisions; the process time of the electronic module is 40ms.

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Marian Blejan, Ioana Ilie, Mircea Comes, and Bogdan Lupu "Signal conditioner for LVDT displacement sensors", Proc. SPIE 7297, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies IV, 72972E (7 January 2009); https://doi.org/10.1117/12.823698

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