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6 May 2009 Novel readout circuit architecture realizing TEC-less operation for SOI diode uncooled IRFPA
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Abstract
We have developed a novel readout circuit architecture realizing a TEC-less (Thermo-Electric Cooler) operation for an SOI diode uncooled infrared focal plane array (IRFPA). Through the fabrication of an SOI diode uncooled 320 x 240 IRFPA adopting the readout circuit architecture with our existing 25μm pixel-pitch technology, we demonstrate that the variation of the output DC level of the pixels is successfully suppressed in environmental temperatures from -10°C to 50°C. The developed TEC-less technology greatly enhances the ability of the SOI diode uncooled IRFPA, which inherently possesses excellent uniformity and low noise features.
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Takahiro Ohnakado, Masashi Ueno, Yasuaki Ohta, Yasuhiro Kosasayama, Hisatoshi Hata, Takaki Sugino, Takanori Ohno, Keisuke Kama, Masahiro Tsugai, and Hiroshi Fukumoto "Novel readout circuit architecture realizing TEC-less operation for SOI diode uncooled IRFPA", Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980V (6 May 2009); https://doi.org/10.1117/12.818418
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