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6 May 2009 A 160 x 120 pixel uncooled TEC-less infrared radiation focal plane array on a standard ceramic package
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Abstract
We have developed a 32 μm pitch and 160 × 120 pixel uncooled infrared radiation focal plane array (IRFPA) on SOI by 0.35 μm CMOS technology and bulk-micromachining. For IR detection, we use silicon single crystal series p-n junctions which can realize high uniformity of temperature coefficient and low voltage drift. We have also developed a low-noise CMOS readout circuit on the same SOI which can calibrate the substrate temperature variation in every frame period, comparing two types of pixels, a bulk-micromachined infrared detection pixel and a non-micromachined reference pixel. Then the FPA requires no thermo-electric cooler (TEC) and is mounted on a low-cost standard ceramic package for the consumer products market.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hideyuki Funaki, Hiroto Honda, Ikuo Fujiwara, Hitoshi Yagi, Kouichi Ishii, and Keita Sasaki "A 160 x 120 pixel uncooled TEC-less infrared radiation focal plane array on a standard ceramic package", Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72980W (6 May 2009); https://doi.org/10.1117/12.819034
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