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6 May 2009An uncooled 1280 x 1024 InGaAs focal plane array for small platform, shortwave infrared imaging
The increasing demand for short wave infrared (SWIR) imaging technology for soldier-based and unmanned
platforms requires camera systems where size, weight and power consumption are minimized without loss of
performance. Goodrich, Sensors Unlimited Inc. reports on the development of a novel focal plane (FPA) array for
DARPA's MISI (Micro-Sensors for Imaging) Program. This large format (1280 x 1024) array is optimized for
day/night imaging in the wavelength region from 0.4 μm to 1.7 μm and consists of an InGaAs detector bump bonded to a
capacitance transimpedance amplifier (CTIA)-based readout integrated circuit (ROIC) on a compact 15 μm pixel pitch.
Two selectable integration capacitors provide for high dynamic range with low (< 50 electrons) noise, and expanded onchip
ROIC functionality includes analog-to-digital conversion and temperature sensing. The combination of high
quality, low dark current InGaAs with temperature-parameterized non-uniformity correction allows operation at ambient
temperatures while eliminating the need for thermoelectric cooling. The resulting lightweight, low power
implementation is suitable for man-portable and UAV-mounted applications.
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J. Battaglia, M. Blessinger, M. Enriquez, M. Ettenberg, M. Evans, K. Flynn, M. Lin, J. Passe, M. Stern, T. Sudol, "An uncooled 1280 x 1024 InGaAs focal plane array for small platform, shortwave infrared imaging," Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72983C (6 May 2009); https://doi.org/10.1117/12.818761