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6 May 2009 An uncooled 1280 x 1024 InGaAs focal plane array for small platform, shortwave infrared imaging
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The increasing demand for short wave infrared (SWIR) imaging technology for soldier-based and unmanned platforms requires camera systems where size, weight and power consumption are minimized without loss of performance. Goodrich, Sensors Unlimited Inc. reports on the development of a novel focal plane (FPA) array for DARPA's MISI (Micro-Sensors for Imaging) Program. This large format (1280 x 1024) array is optimized for day/night imaging in the wavelength region from 0.4 μm to 1.7 μm and consists of an InGaAs detector bump bonded to a capacitance transimpedance amplifier (CTIA)-based readout integrated circuit (ROIC) on a compact 15 μm pixel pitch. Two selectable integration capacitors provide for high dynamic range with low (< 50 electrons) noise, and expanded onchip ROIC functionality includes analog-to-digital conversion and temperature sensing. The combination of high quality, low dark current InGaAs with temperature-parameterized non-uniformity correction allows operation at ambient temperatures while eliminating the need for thermoelectric cooling. The resulting lightweight, low power implementation is suitable for man-portable and UAV-mounted applications.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Battaglia, M. Blessinger, M. Enriquez, M. Ettenberg, M. Evans, K. Flynn, M. Lin, J. Passe, M. Stern, and T. Sudol "An uncooled 1280 x 1024 InGaAs focal plane array for small platform, shortwave infrared imaging", Proc. SPIE 7298, Infrared Technology and Applications XXXV, 72983C (6 May 2009);

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