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11 May 2009Heterogeneous 3D integration of multi-spectral photonic sensor with highly oriented micro/nano-pillars of semiconductors
We developed a novel method for three-dimensional heterogeneous integration of devices based on any semiconductor
material on a pliant surface with arbitrary surface profile. Arrays of optical detectors in the form of vertically oriented
micro/nano-pillars with diverse bandgaps and physical properties are fabricated via synthetic bottom-up or
transformative top-down approaches on a single crystal surface and then transferred to a different target surface using a
polymer assisted shear-fracturing process. The original wafers are used repeatedly for generating more devices and are
never consumed. Ohmic contacts with low contact resistance are formed for individual electrical addressing of each
layer of sensors using metals and/or conducting polymer such as PAni and PEDOT:PSS. The method offers an
opportunity for device fabrication with low fill factor contributing to lower dark current, reduced parasitic capacitance
and higher efficiency of light absorption.
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V. J. Logeeswaran, Jacob Goodwin, Aaron M. Katzenmeyer, M. Saif Islam, "Heterogeneous 3D integration of multi-spectral photonic sensor with highly oriented micro/nano-pillars of semiconductors," Proc. SPIE 7318, Micro- and Nanotechnology Sensors, Systems, and Applications, 731805 (11 May 2009); https://doi.org/10.1117/12.821791