Heterogeneous 3D integration of multi-spectral photonic sensor with highly oriented micro/nano-pillars of semiconductors

V. J. Logeeswaran; Jacob Goodwin; Aaron M. Katzenmeyer; M. Saif Islam

doi:10.1117/12.821791

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11 May 2009 Heterogeneous 3D integration of multi-spectral photonic sensor with highly oriented micro/nano-pillars of semiconductors

V. J. Logeeswaran, Jacob Goodwin, Aaron M. Katzenmeyer, M. Saif Islam

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Proceedings Volume 7318, Micro- and Nanotechnology Sensors, Systems, and Applications; 731805 (2009) https://doi.org/10.1117/12.821791
Event: SPIE Defense, Security, and Sensing, 2009, Orlando, Florida, United States

Abstract

We developed a novel method for three-dimensional heterogeneous integration of devices based on any semiconductor material on a pliant surface with arbitrary surface profile. Arrays of optical detectors in the form of vertically oriented micro/nano-pillars with diverse bandgaps and physical properties are fabricated via synthetic bottom-up or transformative top-down approaches on a single crystal surface and then transferred to a different target surface using a polymer assisted shear-fracturing process. The original wafers are used repeatedly for generating more devices and are never consumed. Ohmic contacts with low contact resistance are formed for individual electrical addressing of each layer of sensors using metals and/or conducting polymer such as PAni and PEDOT:PSS. The method offers an opportunity for device fabrication with low fill factor contributing to lower dark current, reduced parasitic capacitance and higher efficiency of light absorption.

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V. J. Logeeswaran, Jacob Goodwin, Aaron M. Katzenmeyer, and M. Saif Islam "Heterogeneous 3D integration of multi-spectral photonic sensor with highly oriented micro/nano-pillars of semiconductors", Proc. SPIE 7318, Micro- and Nanotechnology Sensors, Systems, and Applications, 731805 (11 May 2009); https://doi.org/10.1117/12.821791

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