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30 April 2009 Development of high-resolution and light-weight x-ray optics with deformed silicon wafers
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Abstract
We report on our development of hot plastic deformation of silicon wafer for high-resolution and light-weight X-ray optics. The highly polished silicon wafer with an excellent flat surface is a promising candidate for the next generation space X-ray telescopes. Deformation accuracy and stability, especially if elastic deformation is used, are issues. The hot plastic deformation of the silicon wafer allows us 3-dimensional shaping without spring back after the deformation. As a first step of R & D, we conducted the hot plastic deformation of 4-inch silicon (111) wafers with a thickness of 300 μm by using hemispherical dies with a curvature radius of 1000 mm. The deformed wafer kept good surface quality but showed a slightly large curvature of 1030 mm. We measured the X-ray reflectivity of the deformed wafer at Al Kα 1.49 keV. For the first time, we detected the total X-ray reflection on the deformed wafer. Estimated rms surface roughness was 0-1 nm and no significant degradation from the bare silicon wafers was seen.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuichiro Ezoe, Takayuki Shirata, Takaya Ohashi, Manabu Ishida, Kazuhisa Mitsuda, Kozo Fujiwara, Kohei Morishita, and Kazuo Nakajima "Development of high-resolution and light-weight x-ray optics with deformed silicon wafers", Proc. SPIE 7360, EUV and X-Ray Optics: Synergy between Laboratory and Space, 73600B (30 April 2009); https://doi.org/10.1117/12.823932
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