Study of CD variation at EUV mask fabrication occurred by electric conduction from top to back side

Kosuke Takai; Koji Murano; Kazuki Hagihara; Masamitsu Itoh; Tsukasa Abe; Takashi Adachi; Hideo Akizuki; Tadahiko Takikawa; Hiroshi Mohri; Naoya Hayashi

doi:10.1117/12.824332

11 May 2009 Study of CD variation at EUV mask fabrication occurred by electric conduction from top to back side

Kosuke Takai, Koji Murano, Kazuki Hagihara, Masamitsu Itoh, Tsukasa Abe, Takashi Adachi, Hideo Akizuki, Tadahiko Takikawa, Hiroshi Mohri, Naoya Hayashi

Author Affiliations +

Proceedings Volume 7379, Photomask and Next-Generation Lithography Mask Technology XVI; 73792I (2009) https://doi.org/10.1117/12.824332
Event: Photomask and NGL Mask Technology XVI, 2009, Yokohama, Japan

Abstract

Extreme Ultra Violet Lithography (EUVL) is the most leading next generation lithographic technology post ArF immersion lithography. The Structure of EUV mask differ from traditional photomask., especially backside coating. E-chuck is employed to fix the EUV mask on the scanner. Therefore a conductive film on backside of the EUV mask blank is needed. We investigated what have an influence on mask manufacturing process caused by the backside coating differed from a traditional photomask. From our experiment, at the mask fabrication process, especially RIE process to etch Ta absorber, the CD variation is occurred by electric conduction between the backside conductive coating and the absorber on the Mo/Si multi-layer. As a result, the EUV mask blank without electric conduction between the backside conductive coating and the absorber on the Mo/Si multilayer is necessary.

Citation Download Citation

Kosuke Takai, Koji Murano, Kazuki Hagihara, Masamitsu Itoh, Tsukasa Abe, Takashi Adachi, Hideo Akizuki, Tadahiko Takikawa, Hiroshi Mohri, and Naoya Hayashi "Study of CD variation at EUV mask fabrication occurred by electric conduction from top to back side", Proc. SPIE 7379, Photomask and Next-Generation Lithography Mask Technology XVI, 73792I (11 May 2009); https://doi.org/10.1117/12.824332

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
8 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Photomasks

Extreme ultraviolet

Etching

Coating

Extreme ultraviolet lithography

Conductive coatings

Mask making

Show All Keywords

Keywords/Phrases

Search In:

Publication Years