Paper
24 August 2009 Research on a novel packaging structure and technology by red copper slice for fiber Bragg gratings
Wei-na Wu, Si-dong Li, Wen-hua Wang
Author Affiliations +
Proceedings Volume 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors; 73811Q (2009) https://doi.org/10.1117/12.835306
Event: International Symposium on Photoelectronic Detection and Imaging 2009, 2009, Beijing, China
Abstract
The sensing principle of FBG packaged was developed, and packaging technology for fiber Bragg gratings (FBGs) and the embedding technique were studied. A scheme of packaging technology using the red copper slice for FBGs was presented, and experimental results indicate that the strain sensitivity coefficient of FBG packaged is nearly the same as that of the bare FBG, and that the FBG packaged can measure the 1με change, and that the temperature sensitivity coefficient of FBG packaged is 2.97 times as much as that of the bare FBG, and that the packaging structure using red copper slice improves the temperature resolution of demodulation equipment for FBG sensors, and that the FBG packaged sensors can measure the 0.03°C change.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Wei-na Wu, Si-dong Li, and Wen-hua Wang "Research on a novel packaging structure and technology by red copper slice for fiber Bragg gratings", Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73811Q (24 August 2009); https://doi.org/10.1117/12.835306
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KEYWORDS
Fiber Bragg gratings

Packaging

Copper

Sensors

Optical fibers

Structured optical fibers

Temperature metrology

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