Paper
24 August 2009 Integrated thermoelectric infrared sensor with XeF2 etching
De-hui Xu, Bin Xiong, Yue-lin Wang, Mi-feng Liu
Author Affiliations +
Proceedings Volume 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors; 73812M (2009) https://doi.org/10.1117/12.834699
Event: International Symposium on Photoelectronic Detection and Imaging 2009, 2009, Beijing, China
Abstract
In this paper, the design, simulation, fabrication and testing of an integrated thermoelectric infrared sensor have been demonstrated. The integrated thermoelectric sensor has been fabricated by a standard p-well CMOS technology and a maskless XeF2 post-CMOS micromachining process. The modeling of the infrared sensor has been performed numerically using FEM method. With a 2.5 μm thick stacked silicon oxide-nitride-oxide multi-layers as absorber, the prototype sensor achieved a responsivity of 14.7 V W-1, a specific detectivity of 4.07 × 107 cm Hz1/2 W-1 and a time constant about 23 ms. The effects of XeF2 etching on the CMOS devices have also been studied. XeF2 post-CMOS micromachining was found to have insignificant effects on CMOS devices.
© (2009) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
De-hui Xu, Bin Xiong, Yue-lin Wang, and Mi-feng Liu "Integrated thermoelectric infrared sensor with XeF2 etching", Proc. SPIE 7381, International Symposium on Photoelectronic Detection and Imaging 2009: Material and Device Technology for Sensors, 73812M (24 August 2009); https://doi.org/10.1117/12.834699
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KEYWORDS
Etching

Thermoelectric materials

Sensors

Infrared sensors

Micromachining

CMOS devices

Silicon

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