Thin absorber EUVL mask with light-shield border for full-field scanner: flatness and image placement change through mask process

Takashi Kamo; Yuusuke Tanaka; Toshihiko Tanaka; Osamu Suga; Tsukasa Abe; Tadahiko Takikawa; Hiroshi Mohri; Tsutomu Shoki; Youichi Usui

doi:10.1117/12.829873

29 September 2009 Thin absorber EUVL mask with light-shield border for full-field scanner: flatness and image placement change through mask process

Takashi Kamo, Yuusuke Tanaka, Toshihiko Tanaka, Osamu Suga, Tsukasa Abe, Tadahiko Takikawa, Hiroshi Mohri, Tsutomu Shoki, Youichi Usui

Author Affiliations +

Proceedings Volume 7488, Photomask Technology 2009; 748818 (2009) https://doi.org/10.1117/12.829873
Event: SPIE Photomask Technology, 2009, Monterey, California, United States

Abstract

When thinner absorber mask is practically applied to the EUVL for the ULSI chip production, it is inevitable to introduce EUV light shield area in order to suppress leakage of the EUV light from adjacent exposure shots. We believe that light-shield border of multilayer etching type is promising structure in terms of mask process flexibility for higher mask CD accuracy In this paper, we evaluate etching impact of absorber and multilayer on mask flatness and image placement change through mask process of thin absorber mask with light-shield border of multilayer etching type structure. And then, we clarify the relation between mask flatness and mask image placement shift.

Citation Download Citation

Takashi Kamo, Yuusuke Tanaka, Toshihiko Tanaka, Osamu Suga, Tsukasa Abe, Tadahiko Takikawa, Hiroshi Mohri, Tsutomu Shoki, and Youichi Usui "Thin absorber EUVL mask with light-shield border for full-field scanner: flatness and image placement change through mask process", Proc. SPIE 7488, Photomask Technology 2009, 748818 (29 September 2009); https://doi.org/10.1117/12.829873

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KEYWORDS

Photomasks

Etching

Image processing

Extreme ultraviolet lithography

Multilayers

Photoresist processing

Scanners

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