Paper
21 October 2009 The exploration of laser ablation combined with chemical flow etching
Genfu Yuan, Yansheng Yao, Yuping Ma, Xuehui Chen, Huaqi Liang, Shaofeng Zhu
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Abstract
A novel approach Laser Ablation Combined with Chemical Flow Etching is proposed. How laser pluses energy density, repetition rate, pulse width, scan velocity and other parameters cause the eclipsed quantity and the surface quality by combining etching method on metal materials is studied by using experiments. Moreover the effects of corrosive style, its concentration and rushing velocity and other flow parameters are also analyzed in combining process. Experimental results show that the new approach is inspiring in enhancing surface quality and machining velocity. It is obvious that the liquid is the important factor of reducing lags and roughness, also of increasing eclipsing quantity.
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Genfu Yuan, Yansheng Yao, Yuping Ma, Xuehui Chen, Huaqi Liang, and Shaofeng Zhu "The exploration of laser ablation combined with chemical flow etching", Proc. SPIE 7515, Photonics and Optoelectronics Meetings (POEM) 2009: Industry Lasers and Applications, 75150R (21 October 2009); https://doi.org/10.1117/12.842962
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KEYWORDS
Etching

Pulsed laser operation

Laser ablation

Laser processing

Laser energy

Wet etching

Laser applications

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