3D integration opportunities, issues, and solutions: a designer's perspective

Ding-Ming Kwai; Cheng-Wen Wu

doi:10.1117/12.845747

8 December 2009 3D integration opportunities, issues, and solutions: a designer's perspective

Ding-Ming Kwai, Cheng-Wen Wu

Proceedings Volume 7520, Lithography Asia 2009; 752003 (2009) https://doi.org/10.1117/12.845747
Event: SPIE Lithography Asia, 2009, Taipei, Taiwan

Abstract

As the development cost of a typical system-on-chip (SOC) using state-of-the-art technology soars, more and more people turn to three-dimensional (3D) integration for possible alternatives that provide better or equal performance with lower cost. Stacking dies using the through-silicon-via (TSV) technology has been considered one of the most promising solutions to extending the life of Moore's law in semiconductor industry, but of course there are problems to be solved before the infrastructure can be set up to support the industry for manufacturing TSV-based 3D integrated devices. In this paper we will discuss the opportunities, design and manufacturing issues, and possible solutions for 3D integrated devices, from a designer's perspective.

Citation Download Citation

Ding-Ming Kwai and Cheng-Wen Wu "3D integration opportunities, issues, and solutions: a designer's perspective", Proc. SPIE 7520, Lithography Asia 2009, 752003 (8 December 2009); https://doi.org/10.1117/12.845747

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available