Revisiting adoption of high transmission PSM: pros, cons and path forward

Z. Mark Ma; Steve McDonald; Chris Progler

doi:10.1117/12.838246

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11 December 2009 Revisiting adoption of high transmission PSM: pros, cons and path forward

Z. Mark Ma, Steve McDonald, Chris Progler

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Proceedings Volume 7520, Lithography Asia 2009; 752017 (2009) https://doi.org/10.1117/12.838246
Event: SPIE Lithography Asia, 2009, Taipei, Taiwan

Abstract

High transmission attenuated phase shift masks (Hi-T PSM) have been successfully applied in volume manufacturing for certain memory devices. Moreover, numerous studies have shown the potential benefits of Hi-T PSM for specific lithography applications. In this paper, the potential for extending Hi-T PSM to logic devices, is revisited with an emphasis on understanding layout, transmission, and manufacturing of Hi-T PSM versus traditional 6% embedded attenuated phase shift mask (EAPSM). Simulations on various layouts show Hi-T PSM has advantage over EAPSM in low duty cycle line patterns and high duty cycle space patterns. The overall process window can be enhanced when Hi- T PSM is combined with optimized optical proximity correction (OPC), sub-resolution assist features (SRAF), and source illumination. Therefore, Hi-T PSM may be a viable and lower cost alternative to other complex resolution enhancement technology (RET) approaches. Aerial image measurement system (AIMS) results on test masks, based on an inverse lithography technology (ILT) generated layout, confirm the simulation results. New advancement in high transmission blanks also make low topography Hi-T PSM a reality, which can minimize scattering effects in high NA lithography.

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Z. Mark Ma, Steve McDonald, and Chris Progler "Revisiting adoption of high transmission PSM: pros, cons and path forward", Proc. SPIE 7520, Lithography Asia 2009, 752017 (11 December 2009); https://doi.org/10.1117/12.838246

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