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11 February 2010 Generic packaging concepts in the frame of network of excellence ePIXnet
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Generic packaging concepts for silicon photonics have been developed in the frame of EU-funded Network of Excellence ePIXnet (FP6). Three approaches for Silicon photonic packaging will be presented within this paper. Two concepts provide solutions for fiber array coupling to high-index contrast photonic wire waveguide gratings. Third concept is the integration of inverted taper-based fiber coupling structure with silicon etched V-grooves. Using standardized SOI chip designs and commercial available assembly parts, the packaging concepts allow for small footprint or flexible use in an R&D environment. The work presented here has resulted from cooperation within the European Network of Excellence ePIXnet.
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Tolga Tekin, Lars Zimmermann, Henning Schröder, Pieter Dumon, Wim Bogaerts, Jose Vicente Galan, Pablo Sanchis, William Whelan-Curtin, and Daryl Beggs "Generic packaging concepts in the frame of network of excellence ePIXnet", Proc. SPIE 7604, Integrated Optics: Devices, Materials, and Technologies XIV, 76040I (11 February 2010);

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