Laser-formed bumps on glass for precision alignment of planar optical components

James S. Sutherland; Alexander M. Streltsov; Richard R. Grzybowski; B. Roe Hemenway

doi:10.1117/12.842386

23 February 2010 Laser-formed bumps on glass for precision alignment of planar optical components

James S. Sutherland, Alexander M. Streltsov, Richard R. Grzybowski, B. Roe Hemenway

Proceedings Volume 7607, Optoelectronic Interconnects and Component Integration IX; 760711 (2010) https://doi.org/10.1117/12.842386
Event: SPIE OPTO, 2010, San Francisco, California, United States

Abstract

This paper describes hybrid assembly of a wavelength selective switch using laser-formed glass bumps. Recently, a process was developed for forming raised bumps on IR-absorbing glass substrates using a focused laser beam. Glass bumps with heights exceeding 90 μm have been formed with an accuracy of ~100 nm using multiple laser shots. Proper selection of materials permits the bump height to be raised or lowered via subsequent laser shots by adjusting laser power. Processes are described for precision alignment of planar AWG components to a pedestal-mounted planar SOA array by forming three glass laser bumps beneath the AWG components. While the iterative process of bump formation and component position assessment was performed manually, this work demonstrates that the process is predictable and well-suited for automation.

Citation Download Citation

James S. Sutherland, Alexander M. Streltsov, Richard R. Grzybowski, and B. Roe Hemenway "Laser-formed bumps on glass for precision alignment of planar optical components", Proc. SPIE 7607, Optoelectronic Interconnects and Component Integration IX, 760711 (23 February 2010); https://doi.org/10.1117/12.842386

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