Productivity improvement in the wafer bevel and backside cleaning before exposure

Yoichi Tokunaga; Shuuichi Nishikido; Kousuke Yoshihara; Zoe Hong; Marlene Strobl; Yu Chen Lin

doi:10.1117/12.846488

30 March 2010 Productivity improvement in the wafer bevel and backside cleaning before exposure

Yoichi Tokunaga, Shuuichi Nishikido, Kousuke Yoshihara, Zoe Hong, Marlene Strobl, Yu Chen Lin

Author Affiliations +

Proceedings Volume 7639, Advances in Resist Materials and Processing Technology XXVII; 763924 (2010) https://doi.org/10.1117/12.846488
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

The Back-side Surface Treatment ("BST") is a module that cleans the backside of a wafer just before a process on the exposure system. To support immersion lithography, Tokyo Electron introduces a bevel cleaning function to this module. This enables cleaning of both wafer backside and bevel section at the same time. We evaluate the new BST module for wafer cleaning performance, wafer backside cleaning performance and wafer topside particle control performance. The effectiveness of the BST module is tested in an actual production line. It is proved that the introduction of the BST module reduces defocus and blocked images.

Citation Download Citation

Yoichi Tokunaga, Shuuichi Nishikido, Kousuke Yoshihara, Zoe Hong, Marlene Strobl, and Yu Chen Lin "Productivity improvement in the wafer bevel and backside cleaning before exposure", Proc. SPIE 7639, Advances in Resist Materials and Processing Technology XXVII, 763924 (30 March 2010); https://doi.org/10.1117/12.846488

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