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3 March 2010 Overlay characterization and matching of immersion photoclusters
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Many factors are driving a significant tightening of the overlay budget for advanced technology nodes, e.g. 6nm [mean + 3σ] for 22nm node. Exposure tools will be challenged to support this goal, even with tool dedication. However, tool dedication has adverse impact on cycle time reduction, line productivity and cost issues. There is a strong desire to have tool to tool (and chuck to chuck) matching performance, which supports the tight overlay budgets without tool dedication. In this paper we report improvements in overlay metrology test methods and analysis methods which support the needed exposure tool overlay capability.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Blandine Minghetti, Timothy Brunner, Christopher Robinson, Christopher Ausschnitt, Dan Corliss, and Nelson Felix "Overlay characterization and matching of immersion photoclusters", Proc. SPIE 7640, Optical Microlithography XXIII, 76400W (3 March 2010);

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