A novel method to reduce wafer topography effect for implant lithography process

Lei Yuan; Sanggil Bae; Yong Feng Fu; Ao Chen; Hui Peng Koh; Qun Ying Lin

doi:10.1117/12.846002

3 March 2010 A novel method to reduce wafer topography effect for implant lithography process

Lei Yuan, Sanggil Bae, Yong Feng Fu, Ao Chen, Hui Peng Koh, Qun Ying Lin

Proceedings Volume 7640, Optical Microlithography XXIII; 76403E (2010) https://doi.org/10.1117/12.846002
Event: SPIE Advanced Lithography, 2010, San Jose, California, United States

Abstract

Wafer topography structures in the implant lithography process, which include the shallow trench isolation and the poly gate, can result into a severe degradation of the resist profile and significant critical dimension variation. While bottom anti-reflective coating (BARC) is not suitable for the implant lithography because of the plasma induced substrate damage, developable bottom anti-reflective coating (DBARC) is now the most promising solution to eliminate wafer topography effects for the implant layer lithography. Currently, some challenges still remain to be solved and DBARC is not ready for mass production yet. In this study, a novel method is proposed to improve wafer topography effects by use of sub-resolution features. Compared with DBARC, this new approach is much more cost effective. Numerical study by use of Sentaurus-Litho simulation tool shows that the new method is promising and deserves more comprehensive investigation.

Citation Download Citation

Lei Yuan, Sanggil Bae, Yong Feng Fu, Ao Chen, Hui Peng Koh, and Qun Ying Lin "A novel method to reduce wafer topography effect for implant lithography process", Proc. SPIE 7640, Optical Microlithography XXIII, 76403E (3 March 2010); https://doi.org/10.1117/12.846002

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