A one-dimensional rate-dependent constitutive model for thermomechanical behavior of superelastic shape memory alloys

Hui Qian; Wenjie Ren; Huai Chen; Haichang Gu; Sihua Zhang

doi:10.1117/12.847001

12 April 2010 A one-dimensional rate-dependent constitutive model for thermomechanical behavior of superelastic shape memory alloys

Hui Qian, Wenjie Ren, Huai Chen, Haichang Gu, Sihua Zhang

Author Affiliations +

Proceedings Volume 7643, Active and Passive Smart Structures and Integrated Systems 2010; 76430F (2010) https://doi.org/10.1117/12.847001
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2010, San Diego, California, United States

Abstract

Shape memory alloys (SMAs) are a relatively new class of functional materials, exhibiting unique thermo-mechanical behaviors, such as shape memory effect and superelasticity, which enable their great potentials in seismic engineering as energy dissipation devices. This paper presents a study of the mechanical behaviors of superelastic SMAs, specially emphasizing on the influence of strain rate under various strain amplitudes. Cyclic tensile tests on superelastic NiTi SMA wires with different diameters under quasi-static and dynamic loadings were carried out to assess their dynamic behaviors. An internal temperature variable which indicates the influence of loading frequency under various strain amplitudes and different temperatures was introduced to the Liang's constitutive equation of SMA. Numerical simulation results based on the proposed constitutive equations and experimental results are in good agreement. The findings in this paper will assist the future design of superelatic SMA-based energy dissipation devices for seismic protection of structures.

Citation Download Citation

Hui Qian, Wenjie Ren, Huai Chen, Haichang Gu, and Sihua Zhang "A one-dimensional rate-dependent constitutive model for thermomechanical behavior of superelastic shape memory alloys", Proc. SPIE 7643, Active and Passive Smart Structures and Integrated Systems 2010, 76430F (12 April 2010); https://doi.org/10.1117/12.847001

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