Polymer encapsulated 2.5D sensor arrays as building blocks for creating smart objects

Maryna Lishchynska; Liam Moore; Daniel Rogoz; Kieran Delaney; John Barrett

doi:10.1117/12.847551

8 April 2010 Polymer encapsulated 2.5D sensor arrays as building blocks for creating smart objects

Maryna Lishchynska, Liam Moore, Daniel Rogoz, Kieran Delaney, John Barrett

Proceedings Volume 7648, Smart Sensor Phenomena, Technology, Networks, and Systems 2010; 76480O (2010) https://doi.org/10.1117/12.847551
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2010, San Diego, California, United States

Abstract

One of the key challenges in developing effective and scalable technologies necessary to realise future pervasive systems and ubiquitous computing is implementing a methodology that genuinely integrates embedded sensing and processing capabilities with everyday materials and objects. Embedding intelligent systems into polymer materials and using such "smart blocks" for constructing smart objects is a promising way to achieve the above. This work provides new solutions to challenges of realising a functional system, comprising sensing, processing and actuating components, fully encapsulated in a block of polymer material. The paper also investigates the possibilities of connecting arrays of such smart blocks in 1.5-D and 2.5-D arrangements to form a modular smart object. Experimental and numerical studies were conducted to establish a level of degradation in mechanical properties and strength of the plastic materials embedded with inserts. In current work, a bare cubic system and the system in a capsule-like package were realised and tested. The results of a full physical characterisation of both individual smart blocks and smart block arrays are presented.

Citation Download Citation

Maryna Lishchynska, Liam Moore, Daniel Rogoz, Kieran Delaney, and John Barrett "Polymer encapsulated 2.5D sensor arrays as building blocks for creating smart objects", Proc. SPIE 7648, Smart Sensor Phenomena, Technology, Networks, and Systems 2010, 76480O (8 April 2010); https://doi.org/10.1117/12.847551

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KEYWORDS

Sensors

Electronics

Polymers

Sensing systems

Intelligence systems

Embedded systems

3D modeling

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