CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 7658 > Article
Paper
22 October 2010 Influence of baffle on improving the thickness uniformity of thin film deposited by magnetron sputtering system
He Yu, Yadong Jiang, Tao Wang, Zhiming Wu, Jing Jiang, Hongjun Jing
Author Affiliations +
Proceedings Volume 7658, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Detector, Imager, Display, and Energy Conversion Technology; 76581N (2010) https://doi.org/10.1117/12.866615
Event: 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies, 2010, Dalian, China
Abstract
The way of improving the thickness uniformity of the thin film deposited by magnetron sputtering system is presented in this paper. A simple model for the magnetron sputtering system with a baffle between cathode target and substrate is described. Based on this model, it is possible to predict the relative deviation of film thickness with this baffle-model by taking the shape and size of baffle into the consideration. The purpose of this article is to explain how different baffle parameters affect the uniformity of thin film using the method of finite element with rectangle target in this magnetron system. It is found that there may exist optimum baffle conditions where the relative deviation of thin film thickness is less than 3 % with a diameter of Φ 150 mm substrate.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
He Yu, Yadong Jiang, Tao Wang, Zhiming Wu, Jing Jiang, and Hongjun Jing "Influence of baffle on improving the thickness uniformity of thin film deposited by magnetron sputtering system", Proc. SPIE 7658, 5th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Detector, Imager, Display, and Energy Conversion Technology, 76581N (22 October 2010); https://doi.org/10.1117/12.866615
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 5 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Thin films
Sputter deposition
Thin film deposition
Chemical species
Thin film devices
Metals
Particles
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top