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26 April 2010 Radiometer-on-a-chip: a path toward super-compact submillimeter-wave imaging arrays
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Abstract
A novel approach for submillimeter-wave heterodyne imaging arrays is presented in this paper. By utilizing diverse technologies such as GaAs membrane based terahertz diodes, wafer bonding, bulk Si micromachining, micro-lens optics, and CMOS 3-D chip architectures, a super-compact low-mass submillimeter-wave imaging array is envisioned. A fourwafer based silicon block for a working W-band power amplifier MMIC is demonstrated. This module drastically reduces mass and volume associated with metal block implementations without sacrificing performance. A path towards super compact array receivers in the 500-600 GHz range is described in detail.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Imran Mehdi, Bertrand Thomas, Choonsup Lee, Goutam Chattopadhyay, Robert Lin, Erich Schlecht, Alex Peralta, John Gill, Ken Cooper, Nuria Llombart, and Peter Siegel "Radiometer-on-a-chip: a path toward super-compact submillimeter-wave imaging arrays", Proc. SPIE 7671, Terahertz Physics, Devices, and Systems IV: Advanced Applications in Industry and Defense, 767105 (26 April 2010); https://doi.org/10.1117/12.850229
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