Paper
14 May 2010 Scatterometric analysis of chatter marks occurring in industrial grinding processes
J. Böhm, A. Vernes, M. Jech, M. Vellekoop
Author Affiliations +
Abstract
Grinding processes often underlie chattering which results in a wavy surface of the ground metal sheet. In this work it will be shown that the angle resolved light scattering method is not only suitable to monitor industrial grinding processes, in both waviness and roughness modes, but also enables the determination of the waviness of a ground surface. Furthermore it is demonstrated that the roughness, e.g. the average roughness Ra and roughness depth Rz, of a ground surface directly depends on the grinding pressure. The light scattering value Aq correlates with the roughness values obtained with a stylus probe system. In this way it is proven that the light scattering system unambiguously determines chatter marks and the roughness of a metal sheet during a grinding process.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Böhm, A. Vernes, M. Jech, and M. Vellekoop "Scatterometric analysis of chatter marks occurring in industrial grinding processes", Proc. SPIE 7718, Optical Micro- and Nanometrology III, 77181E (14 May 2010); https://doi.org/10.1117/12.854419
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KEYWORDS
Light scattering

Confocal microscopy

Microscopes

Metals

Radium

Scattering

Optical testing

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