Paper
27 April 2010 A 25-GHz TO-Can header for coaxial laser package on transmission applications
Tien-Tsorng Shih, Pei-Hao Tseng, Hao-Wei Chen, Sung-Mao Wu, Wood-Hi Cheng
Author Affiliations +
Abstract
A new 5-pin transistor outline (TO-Can) header for conventional coaxial laser package has been proposed and demonstrated by using a three-dimensional full-wave electromagnetic simulation tool. The applicability of the simulation tool was verified by a measurement result of a conventional TO-56 header. By adopting a two-session feed-through via and a bent feed-lead, this TO-Can header has the optimal impedance for high-speed modulation. The reflection loss can be controlled beneath -10-dB before 15-GHz with a 50-Ω termination. The 3-dB modulated bandwidth with a load impedance of 5-Ω and 50-Ω is over 23-GHz and 37-GHz, respectively. This TO-Can header provides a low-cost coaxial laser package solution with widely load impedances from 5-Ω to 50-Ω and may apply in the emerging 100-Gigabits Ethernet (100GbE) and next generation Fiber Channel (20GFC) applications.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Tien-Tsorng Shih, Pei-Hao Tseng, Hao-Wei Chen, Sung-Mao Wu, and Wood-Hi Cheng "A 25-GHz TO-Can header for coaxial laser package on transmission applications", Proc. SPIE 7720, Semiconductor Lasers and Laser Dynamics IV, 77201P (27 April 2010); https://doi.org/10.1117/12.853687
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Cited by 1 scholarly publication.
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KEYWORDS
Laser packaging

Modulation

Glasses

Semiconductor lasers

Dielectrics

Inductance

3D modeling

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