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26 May 2010 Evaluation of metrology capabilities of mask inspection equipment
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Proceedings Volume 7748, Photomask and Next-Generation Lithography Mask Technology XVII; 77480O (2010)
Event: Photomask and NGL Mask Technology XVII, 2010, Yokohama, Japan
The demand for aggressive image placement (IP) accuracy and the CD uniformity of Mask is being increasingly accelerated by DPT deployment. It is becoming feasible to improve CD accuracy, by feeding back CD information to mask writer, or by feed-forwarding CD information on a mask to lithography scanner. Moreover, it is also becoming realistically available to improve position accuracy, by feeding back Mask IP information to mask writer. It was necessary to prepare certain special pattern to measure CD and IP, and to measure the pattern with a conventional metrology tool, requiring long measurement time in the event the number of measurement points is large as can be seen with the lately emerging advanced masks. We are developing a function to acquire both CD information and IP information on the mask at the same time the image data acquired are analyzed by mask defect inspection equipment, so that no special pattern may be needed and no additional measurement time is required. We will report on the result of obtaining IP data of a product-like pattern using this function.
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T. Touya, S. Tamamushi, and N. Takamatsu "Evaluation of metrology capabilities of mask inspection equipment", Proc. SPIE 7748, Photomask and Next-Generation Lithography Mask Technology XVII, 77480O (26 May 2010);

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