Translator Disclaimer
Paper
2 September 2010 CZT smart dicing strategy for cost reduction using defect imaging and random-access machining
Author Affiliations +
Abstract
Current spectroscopic detector crystals contain defects that prevent economic production of devices with sufficient energy resolution and stopping power for radioisotope discrimination. This is especially acute for large monolithic crystals due to increased defect opportunity. The proposed approach to cost reduction starts by combining stereoscopic IR and ultrasound (UT) inspection coupled with segmentation and 3D mapping algorithms. A "smart dicing" system uses "random-access" laser-based machining to obtain tiles free of major defects. Application specific grading matches defect type to anticipated performance. Small pieces combined in a modular sensor pack instead of a monolith will make the most efficient use of wafer area.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Eric Tkaczyk, Kristian Andreini, Tan Zhang, Kevin G. Harding, Gil Abramovich, Yana Williams, Christopher A. Nafis, and Wenwu Zhang "CZT smart dicing strategy for cost reduction using defect imaging and random-access machining", Proc. SPIE 7806, Penetrating Radiation Systems and Applications XI, 78060L (2 September 2010); https://doi.org/10.1117/12.865861
PROCEEDINGS
10 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT


Back to Top