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24 September 2010 Damage/organic free ozonated DI water cleaning on EUVL Ru capping layer
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The adaption of EUVL requires the development of new cleaning method for the removal of new contaminant without surface damage. One of the harsh contaminants is the carbon contamination generated during EUV exposure. This highly dense organic contaminant is hardly removed by conventional SPM solution on Ru capped Mo/Si multilayer. The hopeful candidate for this removal is ozonated water (DIO3), which is not only well-known strong oxidizer but also environmentally friendly solution. However, this solution might cause some damage to the Ru capping layer mostly depending on its concentration. For these reasons, DIO3 cleaning solutions, which are generated with various additive gases, were characterized to understand the correlation between DIO3 concentration and damages on 2.5 nm thick ruthenium (Ru) surface. An optimized DIO3 generation method and cleaning condition were developed with reduced surface damage. These phenomena were explained by electrochemical reaction.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Seung-ho Lee, Bong-kyun Kang, Hyuk-min Kim, Min-soo Kim, Han-ku Cho, Chan-uk Jeon, Hyung-ho Ko, Han-shin Lee, Jin-ho Ahn, and Jin-Goo Park "Damage/organic free ozonated DI water cleaning on EUVL Ru capping layer", Proc. SPIE 7823, Photomask Technology 2010, 78232Z (24 September 2010);

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