An in-situ monitoring system on the grinding process

ByoungChang Kim; MinCheol Kwon; JaeBoong Ha; KangWoo Lee

doi:10.1117/12.871632

11 November 2010 An in-situ monitoring system on the grinding process

ByoungChang Kim, MinCheol Kwon, JaeBoong Ha, KangWoo Lee

Proceedings Volume 7855, Optical Metrology and Inspection for Industrial Applications; 785525 (2010) https://doi.org/10.1117/12.871632
Event: Photonics Asia 2010, 2010, Beijing, China

Abstract

We present a non-contact type monitoring system specially devised to control the cutting depth on the grinding process. This system comprises a one axis scanning stage and the imaging system using line camera and collimated white light source. Experimental results prove that the proposed system is useful, especially for the monitoring system in grinding the piston groove on the cylinder with a few micrometers accuracy in the dozens of millimeter area.

Citation Download Citation

ByoungChang Kim, MinCheol Kwon, JaeBoong Ha, and KangWoo Lee "An in-situ monitoring system on the grinding process", Proc. SPIE 7855, Optical Metrology and Inspection for Industrial Applications, 785525 (11 November 2010); https://doi.org/10.1117/12.871632

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