This PDF file contains the front matter associated with SPIE Proceedings Volume 7928, including the Title Page, Copyright information, Table of Contents, Introduction, and Conference Committee listing.

Atomic layer deposition (ALD)/molecular layer deposition (MLD) processes are able to fabricate nano-scaled inorganic/organic multilayers. Such multilayers are essential to novel packaging and interconnect technologies for NEMS/MEMS. ALD/MLD coatings could reduce water vapor transmission rate down to 5X10^-5 g/m²/day or lower for excellent hermetic/vacuum sealing. ALD/MLD coatings can also modify nanowire/nanomesh structures critical to flexible thermal ground planes that can reach an effective thermal conductivity of 30,000 W/mK and heat flux removal of 200 W/cm². ALD/MLD coatings can enhance the stability while reducing thickness of an embedded Li-ion battery. In addition, the ALD/MLD-based inorganic/organic multilayer can be used for interconnecting nanowire-based photonics.

This paper describes novel microscale electrical, optical, and fluidic interconnect networks to address off-chip interconnect challenges in high-performance computing systems as well as to enable 3D heterogeneous integration of CMOS and MEMS/sensors.

Various shapes of microlens arrays (MLAs) were developed by utilizing polymer coating on etched quartz substrates. Spherical and non-spherical plano-concave curvatures were realized via isotropic wet etching of quartz in buffered oxide etchant (BOE), based on diverse design parameters and calculated etching times. The fabricated curvatures showed a high fill-factor and uniform elements in the array. By coating a higher refractive index polymer on the etched quartz, the illuminated light was well focused at the focal plane forming a micronscale light spot array. The experimental focal length was increased from 39.8 to 49.6 μm, as the shape of microlens was flattened. These results well correspond to those obtained from an optical simulation.

The last decade witnessed an explosive growth in research and development efforts devoted to MEMS devices and packaging. The successfully developed MEMS devices are, for example inkjet, pressure sensors, silicon microphones, accelerometers, gyroscopes, MOEMS, micro fuel cells and emerging MEMS. For the next decade, MEMS/MOEMS and nanodevice based products will penetrate into IT, telecommunications, automotive, defense, life sciences, medical and implantable applications. Forecasts say the MEMS market to be $14 billion by 2012. The packaging cost of MEMS/MOEMS products in general is about 70 percent. Unlike today's electronics IC packaging, their packaging are custom-built and difficult due to the moving structural elements. In order for the moving elements of a MEMS device to move effectively in a well-controlled atmosphere, hermetic sealing of the MEMS device in a cap is necessary. For some MEMS devices, such as resonators and gyroscopes, vacuum packaging is required. Usually, the cap is processed at the wafer level, and thus MEMS packaging is truly a wafer level packaging. In terms of MEMS/MOEMS and nanodevice packaging, there are still many critical issues need to be addressed due to the increasing integration density supported by 3D heterogeneous integration of multi-physic components/layers consisting of photonics, electronics, rf, plasmonics, and wireless. The infrastructure of MEMS/MOEMS and nanodevices and their packaging is not well established yet. Generic packaging platform technologies are not available. Some of critical issues have been studied intensively in the last years. In this paper we will discuss about processes, reliability, testing and characterization of MEMS/MOEMS and nanodevice packaging.

Miniaturization, higher performance, and higher bandwidth needs of the electronic industry continue to drive technology innovations through increased levels of integration. Through Silicon Via (TSV) technology along with flip chip technology provides significant improvements over the traditional technologies for packaging VLSI circuits. Silicon Interposers built using TSVs and embedded capacitors provide solutions to the next generation needs of VLSI Packaging. TSV Si interposers also provide a paltform for integrating photonic elements like the laser diodes and optical fibers for next generation high bandwidth VLSI packaging. The presentation describes (i) the TSV technologies developed, (ii) implementation of Si TSV interposer with embedded capacitors for VLSI packaging, and (iii) development of Si TSV interposer for integration of photonics and VLSI subsystems. Reliability results of interposers with embedded capacitors are also presented.

This article presents a novel fiber-based multi-beam laser Doppler vibrometer (LDV). In this design, a single wavelength laser source at 1550 nm combined with several acousto-optic modulators (AOM) form the transmitter head of the LDV. At the receiver side, one single high-speed photo-detector is employed, instead of multiple detectors according to other reported multi-beam laser Doppler vibrometer.1, 2 Utilization of spatial encoding technique allows us to produce transmitted laser beams with different frequency shifts. In this work, a laser source passes through a sequence of totally four AOMs at different regimes, producing a 4×5 laser beam matrix which is then sent onto different points of vibrating targets for measurement. The backscattered light signals are collected back into a single mode fiber by a fiber collimator and combined with a common reference beam. This mixture of optical signals passes through an Erbium Doped Fiber Amplifier (EDFA) before it is detected by a high-speed fiber-based InGaAs photo-detector. With a digital demodulation algorithm implemented in Labview, the phase variations and thus the vibrations of different testing points can be extracted separately from their corresponding frequency bands. The experimental results show it is possible to do a precise vibration measurement on twenty testing points simultaneously using this novel multi-beam LDV.

Scanning White Light Interferometry (SWLI) allows surface characterization of MEMS components. With transparent samples SWLI can image multiple stacked layers. However, since silicon is opaque to visible wavelengths, only the top layer can be measured using visible light. We combined multiple infrared light emitting diodes (IR-LEDs) to achieve adjustable IR illumination. This allows simultaneous measurement of top and bottom surface topographies of silicon samples - such as MEMS membranes- using a SWLI equipped with an IR camera. This advances the state of the art of the field of MEMS characterization by allowing looking under membranes of these devices during operation.

This work describes a method for tracking the dynamics of electrostatic discharge (ESD) sensitive MEMS structures during ESD events, as well as a model for determining the reduced combdrive snap-in voltage under vibration and shock. We describe our ESD test setup, based on the human body model, and optimized for high impedance devices. A brief description of the MEMS tunable grating, the test structure used here, and its operation is followed by results of the measured complex device dynamics during ESD events. The device fails at a voltage up to four times higher than that required to bring the parts into contact. We then present a model for the snap-in of combfingers under shock and vibration. We combine the results of the analytical model for combdrive snap-in developed here with a shock response model to compute the critical shock acceleration conditions that can result in combdrive snap-in as a function of the operating voltage. We discuss the validity regimes for the combdrive snap-in model and show how restricting the operation voltage below the snap-in voltage is not a sufficient criterion to ensure reliable operation especially in environments with large disturbances.

MEMS Reliability, especially the study of the reliability of their physical characteristics, is an area that is still in its infancy [1]. However, reliable MEMS exists already and are produced in hundreds of millions MEMS devices and some of them are even intended to use in safety critical applications. The wide variety of materials and physical principles used make it difficult to give general statements about MEMS reliability. However, in several cases reliability is not even studied, confirmed or modeled. Consequently, the lack of long-term reliable devices reduces their level of acceptance considerably. The aging of MEMS is always connected with the occurrence of defects and their mobility. The creation rate and the mobility of the defects are precursors for the aging behavior. The mobility of defects will be enhanced by greater stress gradients. Both, the stress gradient and the defects can be easily determined by means of High resolution X-Ray techniques (HRXRD). The idea behind is now to connect mechanical stress, thermals load and even radiation damage which lead to the corresponding signal drift of MEMS devices with the structural properties like defect density and mobility. High resolution X-ray diffraction techniques (HRXRD) such as the rocking curve (RC) and the reciprocal space maps (RSM) are well suited to detect this features, leading to the drift of the MEMS devices. High Resolution X-ray diffraction (HRXRD) techniques are therefore very powerful tools to study aging through the determination of the stresses and defects in the devices. We are convinces that these advanced state-of-the art X-ray methods will serve as a useful tool for setting up a fundamental understanding of the reliability and also aging problems of MEMS.

This contribution deals with capacitively actuated Ohmic switches in series single pole single throw (SPST) configuration for DC up to 4 GHz signal frequency (<0.5 dB insertion loss, 35 dB isolation) and in shunt switch SPST configuration for a frequency range from DC up to 80 GHz (<1.2 dB insertion loss, 18 dB isolation at 60 GHz). A novel high aspect ratio MEMS fabrication sequence in combination with wafer level packaging is applied for fabrication of the samples and allows for a relatively large actuation electrode area, and for high actuation force resulting in fast onresponse time of 10 μs and off-response time of 6 μs at less than 5 V actuation voltage. Large actuation electrode area and a particular design feature for electrode over travel and dynamic contact separation lead to high contact force in the closed state and to high force for contact separation to overcome sticking. The switch contacts, which are consisting of noble metal, are made in one of the latest process steps. This minimizes contamination of the contact surfaces by fabrication sequence residuals. A life time of 1 Billion switch cycles has been achieved. This paper covers design for reliability issues and reliability test methods using accelerated life time test. Different test methods are combined to examine electric and mechanical motion parameters as well as RF performance.

Factors affecting the reliability of the ceramic dielectric body of multi layer ceramic capacitors (MLCCs) were explored for several capacitor sizes. Preliminary results indicate a correlation between the materials used for capacitor termination and the emergence of cracks. The authors varied the termination material, shape, and thickness of MLCCs. Under regimes in which boards were subjected to cyclic bending, vibrations, temperature cycling, and high-g loading, cracks have tended to appear on the bottom of the capacitor in proximity to the termination. Flexible termination materials corresponded to reduced crack formation at low strain rates.

The sensitivity of MEMS devices to radiation is reviewed, with an emphasis on radiation levels representative of space missions. While silicon and metals generally do not show mechanical degradation at the radiation levels encountered in most missions, MEMS devices have been reported to fail at doses of as few krad, corresponding to less than one year in most orbits. Radiation sensitivity is linked primarily to the impact on device operation of radiation-induced trapped charge in dielectrics, and thus affects most strongly MEMS devices operating on electrostatic principles. A survey of all published reports of radiation effects on MEMS is presented. The different sensing and actuation physical principles and materials used in MEMS are compared, leading to suggested was to increase radiation tolerance by design, for instance by choice of actuation principle or by electrical shielding of dielectrics.

Surface mount electronic package test boards have been assembled using tin/lead (Sn/Pb) and lead-free (Pb-free or SnAgCu or SAC305) solders. The soldered surface mount packages include ball grid arrays (BGA), flat packs, various sizes of passive chip components, etc. They have been optically inspected after assembly and subsequently subjected to extreme temperature thermal cycling to assess their reliability for future deep space, long-term, extreme temperature environmental missions. In this study, the employed temperature range (-185°C to +125°C) covers military specifications (-55°C to +100°C), extreme cold Martian (-120°C to +115°C), asteroid Nereus (-180°C to +25°C) and JUNO (-150°C to +120°C) environments. The boards were inspected at room temperature and at various intervals as a function of extreme temperature thermal cycling and bake duration. Electrical resistance measurements made at room temperature are reported and the tests to date have shown some change in resistance as a function of extreme temperature thermal cycling and some showed increase in resistance. However, the change in interconnect resistance becomes more noticeable with increasing number of thermal cycles. Further research work will be carried out to understand the reliability of packages under extreme temperature applications (-185°C to +125°C) via continuously monitoring the daisy chain resistance for BGA, Flat-packs, lead less chip packages, etc. This paper will describe the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead and lead-free solder alloys under extreme temperature environments.

We report on a study of the sensitivity of silicon MEMS to proton radiation and mitigation strategies. MEMS can degrade due to ionizing radiation (electron-hole pair creation) and non-ionizing radiation (displacement damage), such as electrons, trapped and solar protons, or cosmic rays, typically found in a space environment. Over the past few years there has been several reports on the effects of ionizing radiation in silicon MEMS, with failure generally linked to trapped charge in dielectrics. However there is near complete lack of studies on displacement damage effects in silicon- MEMS: how does silicon change mechanically due to proton irradiation? We report on an investigation on the susceptibility of 50 μm thick SOI-based MEMS resonators to displacement damages due to proton beams, with energies from 1 to 60 MeV, and annealing of this damage. We measure ppm changes on the Young's modulus and Poisson ratio by means of accurately monitoring the resonant frequency of devices in vacuum using a Laser Doppler Vibrometer. We observed for the first time an increase (up to 0.05%) of the Young's modulus of single-crystal silicon electromagnetically-actuated micromirrors after exposure to low energy protons (1-4 MeV) at high absorbed doses ~ 100 Mrad (Si). This investigation will contribute to a better understanding of the susceptibility of silicon-based MEMS to displacement damages frequently encountered in a space radiation environment, and allow appropriated design margin and shielding to be implemented.

Development of MEMS-based (Micro Electro Mechanical System) components and subsystems for space applications has been going on for at least two decades. The main driver for developing MEMS components for space is miniaturization through reduced mass, volume and power of individual components. However, the commercial breakthrough of MEMS has not occurred within the space business as it has within other branches such as the IT/telecom, the automotive industry, or other areas. In addition to miniaturization, increased redundancy and improved (or in some cases unique) performance has also been achieved by using MEMS-based components. MEMS pressure sensors integrated into the mechanical housing of another component is one example. Another example is an isolation valve which is both redundant and has an integrated particle filter on a single silicon chip weighing less than one gram. Currently there are few space missions using allowing newly developed MEMS devices onboard, but one of the exceptions is the Swedish-built Prisma satellites. One of the Prisma satellites has a MEMS-based cold gas propulsion system onboard, which contains a number of miniaturized and novel components. This paper presents the MEMS based cold gas propulsion system developed for Prisma including a number of novel components and their maiden spaceflight onboard Prisma last year.

We are involved with ESA and CNES since several years, in the analysis of space applications using MOEMS components. A first concept using a Programmable Micro Diffracting Device (PMDG) has been proposed for an astronomical spectrometer with a small field of view. In this application the introduction of a MOEMS component has allowed to reduce the focal plane complexity (one mono detector) and to increase the mission adaptability to the target (programmable mission). An opto mechanical concept has been proposed and first performance assessed. A second concept has been studied and deals with the use of a MOEMS component to realize an innovative spectrometer, so-called convolution spectrometer. In the proposed solution, a MOEMS is used to realize a shifting spectral window (large spectral width) associated to a slight spectral increment. The signal given by the detector being the convolution between the target spectral density and the spectral window, it is then possible to recover the target spectral signal by a deconvolution. A breadboard has been developed, and the concept of the convolution spectrometer has been successfully demonstrated. Finally, some results of analysis will be also given concerning the use of a DMD for Earth observation associated to a push broom detection mode and a large field of view.

MEMS devices have a promising future in space given their inherent low power, low volume, and low mass qualities. In December of 2006, flight testing of the Inertial Stellar Compass (ISC) onboard the Air Force TacSat-2 spacecraft qualified and demonstrated superb MEMS gyros performance in the relevant space environment over a variety of conditions. This development helped reduce the risk and cost associated with selecting MEMS based gyro devices for future space missions further providing spacecraft designers with the full benefits of this new sensor technology. Since the ISC flight, various spaceflight applications in need of low power and low mass rate solutions have been enabled and envisioned for use within the spacecraft application base. This paper describes prior history, proposed applications, and future benefits with the inclusion of MEMS gyros in the spacecraft domain.

Multiple Aperture Transform Chip Heterodyne (MATCH) spectrometers have been developed for targeted remote sensing applications in harsh environments. These waveguide-based Fourier Transform Spectrometers (FTS) offer significant improvements in resource efficiency over monolithic glass implementations, but are relatively limited in terms of input coupling efficiency and fill factor of the input facet. Integrated optics spectrometers have significant resource advantages for space applications. Monolithic Spatial Heterodyne Spectrometers are insensitive to vibration and do not require frequent calibration. In addition, Fourier Transform Spectrometers are known to provide significant performance advantages for emission spectroscopy. Ongoing work will improve the MATCH spectrometer input coupling efficiency from free space. This paper discusses the signal to noise improvements expected by incorporation of surface gratings, or back-thinning and stacking of slabs. We show that the use of surface gratings can increase the throughput over coupling to bare waveguides alone (in a single polarization), and provide close to 100% fill factor, albeit with limited field. Étendue improvements associated with stacked slabs are limited only by the sensing area available, but the fill factor of the input facet is limited to ~10%. The impact of these improvements is assessed in the context of two space-based applications: 1) Atmospheric remote sensing in the context of Spatial Heterodyne Observations of Water (solar occultation absorption spectroscopy) near 1.3 μm and 2) Point emission spectroscopy (LIBS/Raman/fluorescence) for mineral identification on a planetary rover.

Novel developments in antibody micro-array technology allow the development of very sensitive instrument that is capable of detecting a wide variety of different biomarkers from a sample liquid. An international consortium led by the UK is currently developing the Life Marker Chip as an analytical instrument for the ExoMars mission in 2018 based on the use of immunoassay technique. In this paper it will be discussed how micro/nano system hardware has been designed and the connected fabrication technology has been developed, compatible with the requirements of a Mars mission instrument and allowing a seamless integration in the instrument. A microfluidic fused silica chip integrates all the relevant components for the analysis/assay procedure (except the pumping, which is performed by a syringe-type bellows pump). The fluidic chip therefore contains an entries for intake of the pretreated sample, chambers for the solution of preloaded reagents and the hybridization reaction, liquid front sensors, inputs and output ports for the selector valve and a channel structure connecting these components. Moreover, the design has three parallel fluidic pathways in order to allow for three different classes of assays. The whole fluidic design is driven by the requirement that the dead volumes and the total liquid volume are as small as possible. It appeared that a miniaturized and integrated selector valve has far better properties than a system with numerous integrated and externally, often pneumatically actuated on-off valves. Next to this, the connected volume and mass of the whole fluid management system is lower. An optical array chip incorporates integrated waveguides, which allow for excitation of the fluorescent labels by the evanescent field of the guided light wave. The system had to be designed in such a way that the light of a single fibercoupled lightsource is distributed over all the spots (10 x 10) of the array. The LioniX proprietary waveguide technology TriPleX is the only mature technology that allows this in the required (VIS) wavelength region. The losses of this silicon-nitride based waveguide system are extremely low while allowing bends necessary to distribute the light over a matrix of spots.

This paper presents the interference effect of two intersecting waves on a surface acoustic wave(SAW) devices. The SAW interference device consists of input-output interdigital transducers(IDTs) to transmit and receive a Rayleigh wave and two interference IDTs to transmit shear-horizontal(SH) waves. The SH-waves intersects perpendicularly and interferes with the Rayleigh wave at the delay line. We fabricated the SAW devices with center frequencies ranging from 40 MHz to 200 MHz on a 128° YX LiNbO3 wafer. The result of the characteristic test with a network analyzer shows that the frequency response between the input-output IDTs is shifted by the interference. The center frequency decreases as the magnitude of the interference wave increases, and the frequency shift is at its maximum when the frequency of the interference wave coincides with the center frequency of the interference IDTs. The two interference waves applied simultaneously make the interference effect about twice. Also, interference effect increases with the increase of the center frequency of the interference IDT. This interference effect of two intersecting SAWs is useful to eliminate the cross axis sensitivity in designing the SAW gyroscope based on the interference effect.

This paper presents a novel wireless Love wave biosensor platform for multi-functional detection. A 440MHz wireless and surface acoustic wave (SAW)-based biosensor was developed on a 41° YX LiNbO₃ piezoelectric substrate for the simultaneous detection of Anti- Dinitrophenyl-KLH (anti-DNP) immunoglobulin G (IgG). The developed biosensor was composed of a SAW reflective delay lines structured by an interdigital transducer (IDT), shorted grating reflectors, poly(methyl-methacrylate) (PMMA) layer and two sensitive films (Cr/Au). The PMMA was used for the waveguide layer. Coupling of mode (COM) modeling was conducted to determine the optimal device parameters prior to fabrication. The fabricated devices were wirelessly characterized by using the network analyzer as the reader unit. The binding of anti-DNP to DNP receptor molecules induced a change in phase shifts of the original reflection peaks due to a mass loading effect. The phase shifts increased linearly with increasing anti-DNP concentration. The measured reflective coefficient S11 in the time domain showed high signal/noise (S/N) ratio, small signal attenuation, and few spurious peaks. The time positions of the reflection peaks were well matched with the predicted values from the simulation. The obtained sensitivity was 167.9°/μg/ml and 44.8°/ μg/ml for the 1st and the 2nd sensing area, respectively.

The design of microelectromecanical systems (MEMS) and micro-opto-electromechanical systems (MOEMS) are often materials-limited with respect to the efficiency and capability of the material. Graphene, a one atom thick honeycomb lattice of carbon, is a highly desired material for MEMS applications. Relevant properties of graphene include the material's optical transparency, mechanical strength, energy efficiency, and electrical and thermal conductivity due to its electron mobility. Aforementioned properties make graphene a strong candidate to supplant existing transparent electrode technology and replace the conventionally used material, indium-tin oxide. In this paper we present preliminary results on work toward integration of graphene with MEMS structures. We are studying mechanical exfoliation of highly ordered pyrolytic graphite (HOPG) crystals by repeatedly applying and separating adhesive materials from the HOPG surface. The resulting graphene sheets are then transferred to silicon oxide substrate using the previously applied adhesive material. We explored different adhesive options, particularly the use of Kapton tape, to improve the yield of graphene isolation along with chemical cross-linking agents which operate on a mechanism of photoinsertion of disassociated nitrene groups. These perfluorophenyl nitrenes participate in C=C addition reactions with graphene monolayers creating a covalent binding between the substrate and graphene. We are focusing on maximizing the size of isolated graphene sheets and comparing to conventional exfoliation. Preliminary results allow isolation of few layer graphene (FLG) sheets (n<3) of approximately 10μm x 44μm. Photolithography could possibly be utilized to tailor designs for microshutter technology to be used in future deep space telescopes.

Nano- and hetero-structures of carbon nanotube (CNT) and indium tin oxide (ITO) can control significantly piezoelectric and optoelectronic properties in Microelectromechanical Systems (MEMS) as sensing and actuator under cyclic loading. Optimized preparing conditions were obtained for multi-functional purpose of the specimen by obtaining the best dispersion and turbidity in the solution. Optical transmittance and electrical properties were investigated for CNT and ITO dipping and spraying coating on boro-silicate glass and polyethylene terephthalate (PET) substrates by electrical resistance measurement under cyclic loading and wettability test. Uniform dip-coating was performed using Wilhelmy plate method due to its simple and convenience. Spraying coating was applied to the specimen additionally. The change in the electrical resistance and optical properties of coated layer were mainly dependent upon the number of dip-coating, the concentration of CNT and ITO solutions, and the surface treatment condition. Electric properties of coating layers were measured using four-point probe method, and surface resistance was calculated using a dual configuration method. Optical transmittance of CNT and ITO coated PET film was also evaluated using UV spectrum. Surface energy and their hydrophilic and hydrophobic properties of CNT and ITO coated substrates were investigated by wettability test via static and dynamic contact angle measurements. As the elapsing time of cyclic loading passed, the stability of surface resistance and thus comparative interfacial adhesion between coated layer and substrates was evaluated to compare the thermodynamic work of adhesion, Wa. As dip-coating number increased, surface resistance of coated CNT decreased, whereas the transmittance decreased step-by-step due to the thicker CNT and ITO networked layer. Nano- and heterostructural effects of CNT and ITO solution on the optical and electrical effects have been studied continuously.