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27 January 2011 Large-scale planar lightwave circuits
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Abstract
By leveraging advanced wafer processing and flip-chip bonding techniques, we have succeeded in hybrid integrating a myriad of active optical components, including photodetectors and laser diodes, with our planar lightwave circuit (PLC) platform. We have combined hybrid integration of active components with monolithic integration of other critical functions, such as diffraction gratings, on-chip mirrors, mode-converters, and thermo-optic elements. Further process development has led to the integration of polarization controlling functionality. Most recently, all these technological advancements have been combined to create large-scale planar lightwave circuits that comprise hundreds of optical elements integrated on chips less than a square inch in size.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Serge Bidnyk, Hua Zhang, Matt Pearson, and Ashok Balakrishnan "Large-scale planar lightwave circuits", Proc. SPIE 7941, Integrated Optics: Devices, Materials, and Technologies XV, 794102 (27 January 2011); https://doi.org/10.1117/12.871803
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