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17 January 2011 Packaging technology enabling flexible optical interconnections
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This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials. Electrical circuits on flexible substrates are a very fast growing segment in electronics, but opto-electronics and optics should be able to follow these upcoming trends. This paper presents the back-thinning and packaging of single opto-electronic devices resulting in highly flexible and reliable packages. Optical waveguides and optical out-of-plane coupling structures are integrated inside the same layer stack, resulting in complete VCSEL-to-PD links with low total optical losses and high resistance to heat cycling and moisture exposure.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Erwin Bosman, Geert Van Steenberge, Jeroen Missinne, Bram Van Hoe, Sandeep Kalathimekkad, and Peter Van Daele "Packaging technology enabling flexible optical interconnections", Proc. SPIE 7944, Optoelectronic Interconnects and Component Integration XI, 79440E (17 January 2011);

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