Paper
17 January 2011 300 Gb/s bidirectional fiber-coupled optical transceiver module based on 24 TX + 24 RX "holey" CMOS IC
Fuad E. Doany, Clint L. Schow, Alexander V. Rylyakov, Benjamin G. Lee, Christopher Jahnes, Young Kwark, Christian Baks, Daniel M. Kuchta, Frank Libsch, Jeffrey A. Kash
Author Affiliations +
Abstract
A novel, compact 48-channel optical transceiver module has been designed and fabricated based on a "holey" Optochip - a single-chip CMOS transceiver IC with 24 receiver and 24 laser driver circuits each with a corresponding throughsubstrate optical via (hole). The holes enable 24-channel 850-nm VCSEL and photodiode arrays to be directly flip-chip soldered to the CMOS IC to maximize high-speed performance and facilitate direct fiber-coupling to a standard 4 x 12 MMF array. The Optochips were packaged into complete modules by flip-chip soldering to high-density, high-speed organic carriers. All 48-channels showed good performance up to 12.5 Gb/s/ch providing a 300 Gb/s bidirectional aggregate data rate.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fuad E. Doany, Clint L. Schow, Alexander V. Rylyakov, Benjamin G. Lee, Christopher Jahnes, Young Kwark, Christian Baks, Daniel M. Kuchta, Frank Libsch, and Jeffrey A. Kash "300 Gb/s bidirectional fiber-coupled optical transceiver module based on 24 TX + 24 RX "holey" CMOS IC", Proc. SPIE 7944, Optoelectronic Interconnects and Component Integration XI, 79440I (17 January 2011); https://doi.org/10.1117/12.877076
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Cited by 1 scholarly publication.
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KEYWORDS
Transceivers

Receivers

Vertical cavity surface emitting lasers

Photodiodes

Connectors

Transmitters

Optoelectronics

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