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28 March 2011 Mask registration impact on intrafield on-wafer overlay performance
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Abstract
Improved overlay performance is one of the critical elements in enabling the continuing advancement of the semiconductor integrated circuit (IC) industry. With each advancing process node, additional sources of overlay error and new methods of reducing those errors need to be taken into account. We consider the impact of mask registration or pattern placement errors on intra-field on-wafer overlay performance. Mask registration data is typically minimally sampled and not well incorporated into the wafer fab overlay systems. In this work we consider mask-to-mask overlay and point out the importance of high density sampling as well as the potential for improved mask qualification and disposition.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Guo-Tsai Huang, Alex Chen, Tung-Yaw Kang, S. C. Lee, Frank Laske, Klaus-Dieter Roethe, DongSub Choi, Chiang Reinhart, John C. Robinson, You Seung Jin, Lin Chua, David Tien, and Venkat R. Nagaswami "Mask registration impact on intrafield on-wafer overlay performance", Proc. SPIE 7971, Metrology, Inspection, and Process Control for Microlithography XXV, 797106 (28 March 2011); https://doi.org/10.1117/12.879485
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