Methodology for balancing design and process tradeoffs for deep-subwavelength technologies

Ioana Graur; Tina Wagner; Deborah Ryan; Dureseti Chidambarrao; Anand Kumaraswamy; Jeanne Bickford; Mark Styduhar; Lee Wang

doi:10.1117/12.879537

4 April 2011 Methodology for balancing design and process tradeoffs for deep-subwavelength technologies

Ioana Graur, Tina Wagner, Deborah Ryan, Dureseti Chidambarrao, Anand Kumaraswamy, Jeanne Bickford, Mark Styduhar, Lee Wang

Author Affiliations +

Proceedings Volume 7974, Design for Manufacturability through Design-Process Integration V; 79740C (2011) https://doi.org/10.1117/12.879537
Event: SPIE Advanced Lithography, 2011, San Jose, California, United States

Abstract

For process development of deep-subwavelength technologies, it has become accepted practice to use model-based simulation to predict systematic and parametric failures. Increasingly, these techniques are being used by designers to ensure layout manufacturability, as an alternative to, or complement to, restrictive design rules. The benefit of model-based simulation tools in the design environment is that manufacturability problems are addressed in a design-aware way by making appropriate trade-offs, e.g., between overall chip density and manufacturing cost and yield. The paper shows how library elements and the full ASIC design flow benefit from eliminating hot spots and improving design robustness early in the design cycle. It demonstrates a path to yield optimization and first time right designs implemented in leading edge technologies. The approach described herein identifies those areas in the design that could benefit from being fixed early, leading to design updates and avoiding later design churn by careful selection of design sensitivities. This paper shows how to achieve this goal by using simulation tools incorporating various models from sparse to rigorously physical, pattern detection and pattern matching, checking and validating failure thresholds.

Citation Download Citation

Ioana Graur, Tina Wagner, Deborah Ryan, Dureseti Chidambarrao, Anand Kumaraswamy, Jeanne Bickford, Mark Styduhar, and Lee Wang "Methodology for balancing design and process tradeoffs for deep-subwavelength technologies", Proc. SPIE 7974, Design for Manufacturability through Design-Process Integration V, 79740C (4 April 2011); https://doi.org/10.1117/12.879537

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available