You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
1 April 2011Correlation method based mask to mask overlay metrology
for 32nm node and beyond
The new photomask registration and overlay metrology system PROVETM at Carl Zeiss has been developed and already
delivered to customers to meet the increased industry requirements for pattern registration tools in terms of resolution
and in-die measurement capability. Main drivers of the tool performance specifications are double exposure and double
patterning approaches which will help to extend the 193nm lithography platforms while keeping the semiconductor
industry conform to ITRS roadmap requirements. To guarantee the demanding tool performance, PROVETM features
highly stable hardware components for the stage and environmental control. Moreover, sophisticated image analysis
algorithms as for instance correlation methods have been developed to overcome limitations of standard approaches.
In this paper we focus on mask-to-mask overlay metrology as one of the critical components of modern lithography. To
achieve the challenging requirements with the PROVETM tool, an overlay reproducibility budget is prepared that takes
into account stage, image analysis and global effects like mask loading and environmental control. The corresponding
parts of the budget are quantified by means of PROVETM overlay measurements, performed on typical box-in-frame
structures. This allows the identification of critical error contributions and the corresponding improvement strategies. In
particular, it will be shown, that the new developed correlation methods of PROVETM will significantly reduce image
analysis and camera noise contributions.
D. Seidel,M. Arnz, andD. Beyer
"Correlation method based mask to mask overlay metrology
for 32nm node and beyond", Proc. SPIE 7985, 27th European Mask and Lithography Conference, 79850E (1 April 2011); https://doi.org/10.1117/12.896899
The alert did not successfully save. Please try again later.
D. Seidel, M. Arnz, D. Beyer, "Correlation method based mask to mask overlay metrology for 32nm node and beyond," Proc. SPIE 7985, 27th European Mask and Lithography Conference, 79850E (1 April 2011); https://doi.org/10.1117/12.896899