VGA 17 &#956;m development for compact, low-power systems

A. Durand; J.L. Tissot; P. Robert; S. Cortial; C. Roman; M. Vilain; O. Legras

doi:10.1117/12.888095

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20 May 2011 VGA 17 μm development for compact, low-power systems

A. Durand, J.L. Tissot, P. Robert, S. Cortial, C. Roman, M. Vilain, O. Legras

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Proceedings Volume 8012, Infrared Technology and Applications XXXVII; 80121C (2011) https://doi.org/10.1117/12.888095
Event: SPIE Defense, Security, and Sensing, 2011, Orlando, Florida, United States

Abstract

The high level of accumulated expertise by ULIS and CEA/LETI on uncooled microbolometers made from amorphous silicon has enabled ULIS to develop VGA IRFPA formats with 17 μm pixel-pitch, hence building up the currently available product catalog. This detector keeps all the innovations developed on the 25 μm pixel-pitch ROIC (detector configuration by serial link, low power consumption and wide electrical dynamic range). The specific appeal of this unit lies in the high spatial resolution it provides. The pixel-pitch reduction turns this TEC-less VGA array into a product well adapted for high resolution and compact systems. Electro-optical performances of this IRFPA are presented hereafter as well as recent performance improvement. We will focus on NETD trade-off with wide thermal dynamic range, as well as the high characteristics uniformity and pixel operability, achieved thanks to the mastering of amorphous silicon technology coupled with the ROIC design. Solar exposure is also taken into account and shows that ULIS amorphous silicon is perfectly well suited to sustain high intensity exposure. This technology node associated with advanced packaging technique paves the way to compact low power system.

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A. Durand, J.L. Tissot, P. Robert, S. Cortial, C. Roman, M. Vilain, and O. Legras "VGA 17 μm development for compact, low-power systems", Proc. SPIE 8012, Infrared Technology and Applications XXXVII, 80121C (20 May 2011); https://doi.org/10.1117/12.888095

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