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6 May 2011A polynomial regression approach to subpixel temperature extraction from a single-band thermal infrared image
Target temperature estimation from thermal infrared (TIR) imagery is a complex task that becomes increasingly
more difficult as the target size approaches the size of a projected pixel. At that point the assumption of pixel
homogeneity is invalid as the radiance value recorded at the sensor is the result of energy contributions from
the target material and any other background material that falls within a pixel boundary. More often than not,
thermal infrared pixels are heterogeneous and therefore subpixel temperature extraction becomes an important
capability. Typical subpixel estimation approaches make use of data from multispectral or hyperspectral sensors.
These technologies are expensive and data collected by a multispectral or hyperspectral thermal imagery might
not be readily available for a target of interest.
A methodology has been developed to retrieve the temperature of an object that is smaller than a projected
pixel of a single-band TIR image using physics-based modeling. The process can be broken into two distinct
pieces. In the first part, the Digital Imaging and Remote Sensing Image Generation (DIRSIG) tool will be used
to replicate a collected TIR image based on parameter estimates from the collected image. This is done many
times to build a multi-dimensional lookup table (LUT). For the second part, a regression model is built from
the data in the LUT and is used to perform the temperature retrieval. The results presented are from synthetic
imagery.
Sarah E. Paul andCarl Salvaggio
"A polynomial regression approach to subpixel temperature extraction from a single-band thermal infrared image", Proc. SPIE 8013, Thermosense: Thermal Infrared Applications XXXIII, 801302 (6 May 2011); https://doi.org/10.1117/12.883756
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Sarah E. Paul, Carl Salvaggio, "A polynomial regression approach to subpixel temperature extraction from a single-band thermal infrared image," Proc. SPIE 8013, Thermosense: Thermal Infrared Applications XXXIII, 801302 (6 May 2011); https://doi.org/10.1117/12.883756