MEMS performance challenges: packaging and shock tests

Jiyoung Chang; Chen Yang; Bin Zhang; Liwei Lin

doi:10.1117/12.885552

13 May 2011 MEMS performance challenges: packaging and shock tests

Jiyoung Chang, Chen Yang, Bin Zhang, Liwei Lin

Proceedings Volume 8031, Micro- and Nanotechnology Sensors, Systems, and Applications III; 80311F (2011) https://doi.org/10.1117/12.885552
Event: SPIE Defense, Security, and Sensing, 2011, Orlando, Florida, United States

Abstract

This paper describes recent advances in the MEMS performance challenges with emphases on packaging and shock tests. In the packaging area, metal to metal bonding processes have been developed to overcome limitations of the glass frit bonding by means of two specific methods: (1) pre-reflow of solder for enhanced bonding adhesion, and (2) the insertion of thin metal layer between parent metal bonding materials. In the shock test area, multiscale analysis for a MEMS package system has been developed with experimental verifications to investigate dynamic responses under drop-shock tests. Structural deformation and stress distribution data are extracted and predicted for device fracture and in-operation stiction analyses for micro mechanical components in various MEMS sensors, including accelerometers and gyroscopes.

Citation Download Citation

Jiyoung Chang, Chen Yang, Bin Zhang, and Liwei Lin "MEMS performance challenges: packaging and shock tests", Proc. SPIE 8031, Micro- and Nanotechnology Sensors, Systems, and Applications III, 80311F (13 May 2011); https://doi.org/10.1117/12.885552

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