Wafer bonding for MEMS and CMOS integration

V. Dragoi; E. Pabo; J. Burggraf; G. Mittendorfer

doi:10.1117/12.886699

5 May 2011 Wafer bonding for MEMS and CMOS integration

V. Dragoi, E. Pabo, J. Burggraf, G. Mittendorfer

Proceedings Volume 8066, Smart Sensors, Actuators, and MEMS V; 806622 (2011) https://doi.org/10.1117/12.886699
Event: SPIE Microtechnologies, 2011, Prague, Czech Republic

Abstract

Wafer bonding became during past decade an important technology for MEMS manufacturing and wafer-level 3D integration applications. The increased complexity of the MEMS devices brings new challenges to the processing techniques. In MEMS manufacturing wafer bonding can be used for integration of the electronic components (e.g. CMOS circuitries) with the mechanical (e.g. resonators) or optical components (e.g. waveguides, mirrors) in a single, wafer-level process step. However, wafer bonding with CMOS wafers brings additional challenges due to very strict requirements in terms of process temperature and contamination. These challenges were identified and wafer bonding process solutions will be presented illustrated with examples.

Citation Download Citation

V. Dragoi, E. Pabo, J. Burggraf, and G. Mittendorfer "Wafer bonding for MEMS and CMOS integration", Proc. SPIE 8066, Smart Sensors, Actuators, and MEMS V, 806622 (5 May 2011); https://doi.org/10.1117/12.886699

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