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14 September 2011 Automated 3D IR defect mapping system for CZT wafer and tile inspection and characterization
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In this paper, the design and evaluation of a 3D stereo, near infrared (IR), defect mapping system for CZT inspection is described. This system provides rapid acquisition and data analysis that result in detailed mapping of CZT crystal defects across the area of wafers up to 100 millimeter diameter and through thicknesses of up to 20 millimeter. In this paper, system characterization has been performed including a close evaluation of the bright field and dark field illumination configurations for both wafer-scale and tile-scale inspection. A comparison of microscope image and IR image for the same sample is performed. As a result, the IR inspection system has successfully demonstrated the capability of detecting and localizing inclusions within minutes for a whole CZT wafer. Important information is provided for selecting defect free areas out of a wafer and thereby ensuring the quality of the tile. This system would support the CZT wafer dicing and assembly techniques that enable the economical production of CZT detectors. This capability can improve the yield and reduce the cost of the thick detector devices that are rarely produced today.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yi Liao, Esmaeil Heidari, Gil Abramovich, Christopher Nafis, Amer Butt, Joseph Czechowski, Kevin Harding, and J. Eric Tkaczyk "Automated 3D IR defect mapping system for CZT wafer and tile inspection and characterization", Proc. SPIE 8133, Dimensional Optical Metrology and Inspection for Practical Applications, 81330P (14 September 2011);

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