Thermal-contact-conductance measurement for high-heat-load optics components at SPring-8

T. Takeuchi; M. Tanaka; Y. Senba; H. Ohashi; S. Goto

doi:10.1117/12.894612

28 September 2011 Thermal-contact-conductance measurement for high-heat-load optics components at SPring-8

T. Takeuchi, M. Tanaka, Y. Senba, H. Ohashi, S. Goto

Proceedings Volume 8139, Advances in X-Ray/EUV Optics and Components VI; 813911 (2011) https://doi.org/10.1117/12.894612
Event: SPIE Optical Engineering + Applications, 2011, San Diego, California, United States

Abstract

Thermal contact in water-cooling or cryogenic cooling-cooling condition is used for forming a high-heat-load component at the synchrotron radiation beamline. In SPring-8, for example, cryogenic cooling is used for silicon monochromator crystal with an indium insertion metal at the interface between a copper block and a silicon crystal. To reduce the strain on the silicon crystal with a low contact pressure and a high thermal conductivity, we require a silicon-indium-copper system and an alternative insertion material such as a graphite foil. To measure the thermal contact conductance in a quick measurement cycle under various thermal-contact conditions, we improve the thermal-contact-conductance measurement system in terms of the setup facilitation, precise temperature measurement, and thermal insulation around a sample.

Citation Download Citation

T. Takeuchi, M. Tanaka, Y. Senba, H. Ohashi, and S. Goto "Thermal-contact-conductance measurement for high-heat-load optics components at SPring-8", Proc. SPIE 8139, Advances in X-Ray/EUV Optics and Components VI, 813911 (28 September 2011); https://doi.org/10.1117/12.894612

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