Translator Disclaimer
8 September 2011 Optical communication components based on non-silicon MEMS technology
Author Affiliations +
This paper presents non-silicon MEMS technology for fabrication of Optical communication components. Both pure non-silicon and combined micromachining technologies were realized. For the pure non-silicon surface micromachining technology, the Ni and permalloy were chosen as the structure layer; the photo resist and copper were chosen as the sacrificial layer. Based on the technology, the micro-hinge was realized. It may find ample application in the out-of-plane microstructure, which is common in free-space optical transmission. As an example, a MEMS variable optical attenuator is introduced. It consisted of a hinged shutter to adjust the optical power transmission between the input and output optical fibers. For the combined micromachining fabrication, the electroplating was combined with the traditional bulk silicon technology to realize some unique structure for passive alignment. For example, we had developed the micro-fabricated nickel clamps for packaging of optical fibers in photonics devices. Compared with the all silicon scheme, this approach only involves one additional sputtering, photolithography, and electroplating process.. The presented non-silicon micromachining process offered more choice of material and facilitated the implementation of structure innovation.
© (2011) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Xu-han Dai, Yi Huang, Gui-fu Ding, and Xiaolin Zhao "Optical communication components based on non-silicon MEMS technology", Proc. SPIE 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies, 819107 (8 September 2011);

Back to Top