TiWN resistive films in an infrared scene projector device and the array fabrication

Shun Zhou; Weiguo Liu; Huan Liu; Changlong Cai; Wengang Qin; Feng Guo

doi:10.1117/12.900113

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8 September 2011 TiWN resistive films in an infrared scene projector device and the array fabrication

Shun Zhou, Weiguo Liu, Huan Liu, Changlong Cai, Wengang Qin, Feng Guo

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Proceedings Volume 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies; 81910T (2011) https://doi.org/10.1117/12.900113
Event: International Symposium on Photoelectronic Detection and Imaging 2011, 2011, Beijing, China

Abstract

Microemitter resistor arrays are one popular approach to obtaining an infrared scene projector capable of wide dynamic range. Typically, the array operates in a two-level architecture wherein the array resides suspended on support legs. In the structure, the resistive films must provide the high resistivity and the resistivity can be easily controlled. Moreover, the resistive films also must be stable at high temperature and having low temperature coefficient of resistance (TCR). Transition metal nitrides can meet the requirement of the microemitter resistor. Among various transition metal nitrides, HfN, ZrN and TiN films have been used as resistive films in dynamic infrared scene generation. While compared the binary alloys above, the ternary compounds such as TiWN film has better performance. For example, TiWN film shows higher adhesion and corrosion resistance and provides better barrier properties. In this paper, TiWN films were deposited by reactive RF sputtering. The influence of the nitrogen partial pressure ratio on the properties of TiWN films was studied. The results show the electrical resistivity of the TiWN films can be determined by the nitrogen partial pressure ratio and the films have high temperature stability. In addition, long serpentine structure of TiWN films was fabricated in order to demonstrate the application in an infrared scene projector, The arrays were fabricated on a polyimide layer on a silicon wafer substrate or a chip by using conventional techniques for photolithography, etching, electric plating and vacuum deposition.

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Shun Zhou, Weiguo Liu, Huan Liu, Changlong Cai, Wengang Qin, and Feng Guo "TiWN resistive films in an infrared scene projector device and the array fabrication", Proc. SPIE 8191, International Symposium on Photoelectronic Detection and Imaging 2011: Sensor and Micromachined Optical Device Technologies, 81910T (8 September 2011); https://doi.org/10.1117/12.900113

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