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15 February 2012Micro-optical system based 3D imaging for full HD depth image capturing
20 Mega-Hertz-switching high speed image shutter device for 3D image capturing and its application to system
prototype are presented. For 3D image capturing, the system utilizes Time-of-Flight (TOF) principle by means of
20MHz high-speed micro-optical image modulator, so called 'optical shutter'. The high speed image modulation is
obtained using the electro-optic operation of the multi-layer stacked structure having diffractive mirrors and optical
resonance cavity which maximizes the magnitude of optical modulation. The optical shutter device is specially designed
and fabricated realizing low resistance-capacitance cell structures having small RC-time constant. The optical shutter is
positioned in front of a standard high resolution CMOS image sensor and modulates the IR image reflected from the
object to capture a depth image. Suggested novel optical shutter device enables capturing of a full HD depth image with
depth accuracy of mm-scale, which is the largest depth image resolution among the-state-of-the-arts, which have been
limited up to VGA. The 3D camera prototype realizes color/depth concurrent sensing optical architecture to capture
14Mp color and full HD depth images, simultaneously. The resulting high definition color/depth image and its capturing
device have crucial impact on 3D business eco-system in IT industry especially as 3D image sensing means in the fields
of 3D camera, gesture recognition, user interface, and 3D display. This paper presents MEMS-based optical shutter
design, fabrication, characterization, 3D camera system prototype and image test results.
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Yong-Hwa Park, Yong-Chul Cho, Jang-Woo You, Chang-Young Park, Heesun Yoon, Sang-Hun Lee, Jong-Oh Kwon, Seung-Wan Lee, "Micro-optical system based 3D imaging for full HD depth image capturing," Proc. SPIE 8252, MOEMS and Miniaturized Systems XI, 82520X (15 February 2012); https://doi.org/10.1117/12.905946