Novel optical interconnect devices applying mask-transfer self-written method

Nobuhiko Ishizawa; Yusuke Matsuzawa; Yu Tokiwa; Kenichi Nakama; Osamu Mikami

doi:10.1117/12.907326

2 February 2012 Novel optical interconnect devices applying mask-transfer self-written method

Nobuhiko Ishizawa, Yusuke Matsuzawa, Yu Tokiwa, Kenichi Nakama, Osamu Mikami

Proceedings Volume 8267, Optoelectronic Interconnects XII; 82670K (2012) https://doi.org/10.1117/12.907326
Event: SPIE OPTO, 2012, San Francisco, California, United States

Abstract

The introduction of optical interconnect technology is expected to solve problems of conventional electric wiring. One of the promising technologies realizing optical interconnect is the self-written waveguide (SWW) technology with lightcurable resin. We have developed a new technology of the "Mask-Transfer Self-Written (MTSW)" method. This new method enables fabrication of arrayed M x N optical channels at one shot of UV-light. Using this technology, several new optical interconnect devices and connection technologies have been proposed and investigated. In this paper, first, we introduce MTSW method briefly. Next, we show plug-in alignment approach using optical waveguide plugs (OWP) and a micro-hole array (MHA) which are made of the light-curable resin. Easy and high efficiency plug-in alignment between fibers and an optoelectronic-printed wiring board (OE-PWB), between a fiber and a VCSEL, so on will be feasible. Then, we propose a new three-dimensional (3D) branch waveguide. By controlling the irradiating angle through the photomask aperture, it will be possible to fabricate 2-branch and 4-branch waveguides with a certain branch angle. The 3D branch waveguide will be very promising in the future optical interconnects and coupler devices of the multicore optical fiber.

Citation Download Citation

Nobuhiko Ishizawa, Yusuke Matsuzawa, Yu Tokiwa, Kenichi Nakama, and Osamu Mikami "Novel optical interconnect devices applying mask-transfer self-written method", Proc. SPIE 8267, Optoelectronic Interconnects XII, 82670K (2 February 2012); https://doi.org/10.1117/12.907326

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