CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 8325 > Article
Paper
20 March 2012 Combinatorial process optimization for negative photo-imageable spin-on dielectrics and investigation of post-apply bake and post-exposure bake interactions
Jihoon Kim, Ruzhi M. Zhang, Elizabeth Wolfer, Bharatkumar K. Patel, Medhat Toukhy, Zachary Bogusz, Tatsuro Nagahara
Author Affiliations +
Proceedings Volume 8325, Advances in Resist Materials and Processing Technology XXIX; 83252A (2012) https://doi.org/10.1117/12.916453
Event: SPIE Advanced Lithography, 2012, San Jose, California, United States
Abstract
Patternable dielectric materials were developed and introduced to reduce semiconductor manufacturing complexity and cost of ownership (CoO). However, the bestowed dual functionalities of photo-imageable spin-on dielectrics (PSOD) put great challenges on the material design and development. In this work, we investigated the combinatorial process optimization for the negative-tone PSOD lithography by employing the Temperature Gradient Plate (TGP) technique which significantly reduced the numbers of wafers processed and minimized the developmental time. We demonstrated that this TGP combinatorial is very efficient at evaluating the effects and interactions of several independent variables such as post-apply bake (PAB) and post-exposure bake (PEB). Unlike most of the conventional photoresists, PAB turned out to have a great effect on the PSOD pattern profiles. Based on our extensive investigation, we observed great correlation between PAB and PEB processes. In this paper, we will discuss the variation of pattern profiles as a matrix of PAB and PEB and propose two possible cross-linking mechanisms for the PSOD materials to explain the unusual experimental results.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Jihoon Kim, Ruzhi M. Zhang, Elizabeth Wolfer, Bharatkumar K. Patel, Medhat Toukhy, Zachary Bogusz, and Tatsuro Nagahara "Combinatorial process optimization for negative photo-imageable spin-on dielectrics and investigation of post-apply bake and post-exposure bake interactions", Proc. SPIE 8325, Advances in Resist Materials and Processing Technology XXIX, 83252A (20 March 2012); https://doi.org/10.1117/12.916453
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 12 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Dielectrics
Lithography
Semiconducting wafers
Critical dimension metrology
Polymers
Photoresist materials
Coating
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top